Guoxing Technology talks about the relationship between the key technology of PCB high-end electronics and plasma. PCB is the key technology of high-end electronic equipment, and electronic equipment requires high performance, high speed and lightness, thinness and shortness. In the 21st century, mankind has entered a highly information society, and PCB is an indispensable and important pillar in the information industry. Recalling the difficult course of China's PCB for 50 years, today it has written a glorious page in the history of the world's PCB development. In 2006, China's PCB output value was nearly 13 billion U.S. dollars, making China the world's largest PCB producer. 1. Develop along the path of high-density interconnection technology (HDI) As HDI embodies the most advanced technology of contemporary PCB, it brings fine wire and small aperture to PCB. HDI multi-layer board application terminal electronic products-mobile phones (mobile phones) is a model of HDI cutting-edge development technology. In mobile phones, the PCB motherboard micro-wires (50μm～75μm/50μm～75μm, wire width/spacing) have become the mainstream. In addition, the conductive layer and the thickness of the board are thinned; the conductive pattern is refined, which brings the high density and high performance of electronic equipment. . Over the past two decades, HDI has promoted the development of mobile phones, driving the development of information processing and basic frequency control LSI and CSP chips (packages), and packaging template substrates. It also promotes the development of PCBs. Therefore, it must develop along the path of HDI. 2. Component embedding technology has strong vitality The formation of semiconductor devices (called active components), electronic components (called passive components) or passive components on the inner layer of the PCB. The "component embedded PCB" has begun mass production. The component embedding technology is the PCB functional integrated circuit Great changes, but simulation design methods must be resolved in order to develop. Production technology, inspection quality, and reliability assurance are the top priorities. We must increase resource investment in systems including design, equipment, testing, and simulation in order to maintain strong vitality. 3. Material development in PCB needs to be improved Whether it is rigid PCB or flexible PCB materials, with the globalization of lead-free electronic products, these materials must be made more heat-resistant. Therefore, the new type of high Tg, small thermal expansion coefficient, small dielectric constant, and excellent dielectric loss tangent keep appearing. 4. Bright prospects for photoelectric PCB It uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer that is formed by methods such as lithography, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan and the United States. 5. The manufacturing process needs to be updated and advanced equipment needs to be introduced a, manufacturing process HDI manufacturing has matured and tends to be perfect. With the development of PCB technology, although the commonly used subtractive manufacturing methods in the past still dominate, low-cost processes such as additive and semi-additive methods have begun to emerge. Using nanotechnology to make holes metallized and simultaneously form PCB conductive patterns, a novel manufacturing process method for flexible boards. High-reliability, high-quality printing method, inkjet PCB process. b. Advanced equipment Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices. Uniform plating equipment. Production components embedded (passive active components) manufacturing and installation equipment and facilities. With the development of society, the technology required by the PCB industry is more perfect. At this time, plasma has also become one of the indispensable products in the PCB industry. So what is the concept of plasma? How does it relate to the PCB industry? First, let's take a look. When the temperature continues to rise, the molecular thermal motion of the gaseous matter continues to intensify, and the collisions between them will become more and more intense. The electrons in some atoms will be stripped and no longer bound to the nucleus, but become high-potential and high-kinetic energy. Free electrons, which we call gaseous matter, produce ionization. Since positive ions and electrons always appear in the process of ionization of gaseous substances, the total number of positive charges carried by positive ions and negative charges carried by electrons in ionized gaseous substances is roughly equal. Therefore, from a general perspective, this The ionized gaseous matter is quasi-electrically neutral. We call this state of existence of gaseous matter as plasma (plasma). Plasma is the fourth of matter in addition to the common three states of solid, liquid and gas. state. The concept of plasma was first introduced into physics by American scientists Langmuir and Tonka in 1928. It is more strictly defined: plasma is composed of electrons and positive ions. A collection of substances that are electrically neutral as a whole composed of neutral particles. Plasma exists widely in the universe. The plasma in celestial bodies and space includes the sun, solar wind, interplanetary matter, interstellar nebula, etc. Currently, 99% of the observed cosmic matter is plasma, although its distribution range is very thin. , Common plasmas on the earth include lightning, ionosphere in the atmosphere, aurora, lightning in the middle and upper atmosphere, etc. In layman's terms, plasma is an ionized gas. The relationship between the key technology of high-end PCB electronics and plasma. Currently, the industry generally believes that plasma is the best technology for PCB substrate removal from drilling and etchback. However, plasma etchback is the same as chemical etchback, and it is very difficult to characterize the effect of etchback in the PCB hole after processing. Because the amount of etchback in a process hole is very small (usually only a few microns), and the amount of etchback is also affected by the quality of the hole, the wick effect, etc., it is difficult to correctly judge the actual amount of etchback in a plasma process . Our company's judgment on the effect of chemical etchback is calibrated by the upper and lower limits of the amount of etching on the surface of the FR-4 light board by the potassium permanganate solution. This calibration has a certain truth and the measurement method is relatively simple. However, the specific corresponding relationship between the etched effect of the hole and the amount of surface etching is not given, and the chemical etched amount of the hole changes greatly with the PCB thickness-to-diameter ratio, so this Calibration is not applicable to the situation where the amount of etchback in the hole is precisely controlled.